features

　　－triaxial, digital gyroscope,±2000°/sec dynamic range

　　● 8°/hr in run bias stability

　　● 0.008°/sec/√hz rms rate noise density

　　－triaxial, digital accelerometer dynamic range:±40 g

　　●13μg in run bias stability

　　－triaxial, delta angle and delta velocity outputs

　　－factory calibrated sensitivity, bias, and axial alignment

　　●calibration temperature range:?10°c to +75°c

　　－spi compatible data communications

　　－programmable operation and control

　　●automatic and manual bias correction controls

　　●data ready indicator for synchronous data acquisition

　　●external sync modes: direct, pulse, scaled, and output

　　●on demand self test of inertial sensors

　　●on demand self test of flash memory

　　－single-supply operation (vdd): 3.0 v to 3.6 v

　　－2000 g mechanical shock survivability

　　－operating temperature range:?25°c to +85°c

　　general deion

　　the adis16470 is a miniature mems inertial measurement unit (imu) that includes a triaxial gyroscope and a triaxial accelerometer. each inertial sensor in the adis16470 combines with signal conditioning that optimizes dynamic performance. the factory calibration characterizes each sensor for sensitivity, bias, alignment, linear acceleration (gyroscope bias), and point of percussion (accelerometer location). as a result, each sensor has dynamic compensation formulas that provide accurate sensor measurements over a broad set of conditions.

　　the adis16470 provides a simple, cost effective method for integrating accurate, multiaxis inertial sensing into industrial systems, especially when compared with the complexity and investment associated with discrete designs. all necessary motion testing and calibration are part of the production process at the factory, greatly reducing system integration time. tight orthogonal alignment simplifies inertial frame alignment in navigation systems. the serial peripheral interface (spi) and register structure provide a simple interface for data collection and configuration control.

　　the adis16470 is in a 44-ball, ball grid array (bga) package that is approximately 11 mm×15 mm×11 mm.

　　? 李 进

　　? 深圳博瑞图电子科技有限公司

　　?mob :

　　?qq : 52519094

　　?add :深圳市福田区中航路都会轩3305

　　?email : lijin810230@163.com

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